● 支持双路 Intel® Xeon® Scalable Processors
and Intel®Xeon®Scalable Processors;
● 支持16個內存插槽;
● 支持4 PCI-E 3.0 x16,2 PCI-E 3.0 x8,2 PCI-E
3.0 NVMe x4 Internal Port(s);
● M.2 Interface: PCI-E 3.0 x4;
● M.2 Form Factor: 2260, 2280,
22110;
● M.2 Key: M-Key。
1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s;
2. Intel® C621;
3. Up to 4TB 3DS ECC RDIMM,
DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB Intel© PMem,
DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane? DC Persistent Memory in memory
mode (Cascade Lake only);
4. 4 PCI-E 3.0 x16, 2 PCI-E 3.0
x8, 2 PCI-E 3.0 NVMe x4 Internal Port(s)
M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110,M.2 Key: M-Key;
5. Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10;
6. Dual LAN with 1GbE LAN with Intel® X722;
7. 1 VGA por;
Product SKUs
MBD-X11DPI-N
X11DPI-N
Physical Stats
Form Factor
E-ATX
Dimension
12" x 13" (30.48cm x 33.02cm)
Processor
CPU
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors;
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s;
Core
Up to 28 cores
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors- SP
System Memory
Memory Capacity
16 DIMM slots
Up to 2TB Intel® Optane? Persistent Memory 200 Series, DDR4-2666MHz;
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz;
Up to 2TB Intel® Optane? DC Persistent Memory in memory mode (Cascade Lake only);
Memory Type
2933/2666/2400/2133MHz ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes
LRDIMM: 128GB
RDIMM: 64GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
Intel® C621
SATA
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
ASPEED AST2500
Graphics
ASPEED AST2500 BMC
Network Controllers
Dual LAN with 1GbE LAN with Intel® X722
Input / Output
SATA
14 SATA3 (6Gbps) port(s)
LAN
2 RJ45 Gigabit Ethernet LAN ports
USB
4 USB 2.0 port(s) (2 rear; 2 via header)
3 USB 3.2 Gen1 port(s) (2 via header; 1 type A)
2 USB 3.0 port(s) (2 rear)
Video Output
1 VGA port(s)
Serial Port
2 COM Port(s) (1 header; 1 rear)
DOM
2 SuperDOM (Disk on Module) ports
TPM
TPM Header
Expansion Slots
PCI-E
4 PCI-E 3.0 x16,
2 PCI-E 3.0 x8
M.2
M.2 Interface: PCI-E 3.0 x4
Form Factor: 22110, 2280, 2260
Key: M-Key
System BIOS
BIOS Type
AMI UEFI
Management
Software
PC Health Monitoring
Voltage
Monitors CPU voltages, 3.3V standby, +5V standby, +5V, +3.3V, +12V
LED
UID/Remote UID
Power LED
BMC/IPMI Heartbeat LED
CPU / System Overheat LED
Temperature
Monitoring for CPU and chassis environment
CPU thermal trip support
PECI
FAN
8x 4-pin fan headers (up to 8 fans)
PWM fan speed control
Other Features
UID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, ATX Power connector, ACPI power management, SDDC, NCSI header
Operating Environment
Operating Temperature Range
10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
8% - 90% (non-condensing)
Non Operating Relative Humidity Range
5% - 95% (non-condensing)